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This study aims to investigate the factors responsible for substrate cracking reliability problem in through-glass vias (TGVs), which are critical components for glass-based 2.5 D integration.

Numerical models were used to examine the driving force for substrate cracking in glass interposers due to stress coupling during heating. An analytical solution was used to demonstrate how the energy release rate (ERR) for the glass substrate cracking is affected by the via design and the mismatch in thermal strain. Then, the numerical models were implemented to investigate the design factors effects, such as the pitch distance, via diameter, via pattern, via design, effect from a stress buffer layer and the interposer materials selection on the susceptibility to substrate cracking.

ERR for substrate cracking was found to be directly proportional to the via diameter and the thermal mismatch strain. When a via pattern is implemented for high-density integration, a coupling in the stress fields was identified. This coupling effect was found to depend on the pitch distance, the position of the vias, and the via arrangement, suggesting a via pattern-dependent reliability behavior for glass interposers. Changing the design of the via to an annular shape or a substrate-cored via was found to be a promising approach to reduce the susceptibility to substrate cracking compared to a fully filled solid via. Also, the use of a stress buffer layer, an encouraging design prospect presented for the first time for TGVs in this study, was found to significantly reduce cracking. Finally, alternative via and substrate materials showed lower tendency for substrate cracking, indicating that the reliability of glass interposers can be further enhanced with the implementation of such new materials.

This study signifies the first attempt to comprehensively evaluate the susceptibility to crack formation in glass interposers during heating. Therefore, this study provides new perspectives on how to achieve a significant potential reliability improvement for TGVs.

Glass is a promising interposer substrate for 2.5 D integration; yet detailed analysis of the interfacial reliability of through-glass vias (TGVs) has been lacking. The purpose of this paper is to investigate the design and material factors responsible for the interfacial delamination in TGVs and identify methods to improve reliability.

The interfacial reliability of TGVs is studied both analytically and numerically. An analytical solution is presented to show the dependence of the energy release rate (ERR) for interfacial delamination on the via design and the thermal mismatch strain. Then, finite element analysis (FEA) is used to investigate the influence of detailed design and material factors, including the pitch distance, via aspect ratio, via geometry and the glass and via materials, on the susceptibility to interfacial delamination.

ERR for interfacial delamination is directly proportional to the via diameter and the thermal mismatch strain. Thinner wafers with smaller aspect ratios show larger ERRs. Changing the via geometry from a fully filled via to an annular via leads to lower ERR. FEA results also show that certain material combinations have lower thermal mismatch strains, thus less prone to delamination.

The results and approach presented in this paper can guide the design and development of more reliable 2.5 D glass interposers.

This paper represents the first attempt to comprehensively evaluate the impact of design and material selection on the interfacial reliability of TGVs.

In this research, the authors aim to investigate the impact of product display quantity on consumers' online purchase intention through the diminished pain of payment, in light of signaling theory and mental accounting theory. Additionally, the authors test the role of price in this psychological mechanism.

The authors use a combination of online studies and field experiments to test our predictions. Four online studies are conducted to test the main effect of product display quantity on purchase intention (Studies 1A and 1B), the mediating effect of the diminished pain of payment (Study 2), and the moderating role of price (Study 3). Two field experiments are conducted to strengthen the robustness of our findings.

The findings suggest that product display quantity has a significantly positive impact on purchase intention, mediated by the diminished pain of payment, and this effect is moderated by price.

This is the first study to investigate the effect of product display quantity on online purchase intention. This research advances the discussion of product display quantity, which provides retailers and consumers with a convenient way to communicate with each other and leads to a more relaxed purchase experience.

This study aims to discuss the formation mechanism of members’ emotional attachment to virtual travel communities from an online–offline perspective, focusing on the role of offline tourism experiences.

A questionnaire was designed to survey active travel enthusiast clubs that hold frequent offline tourism activities. A structural equation modeling method was used to estimate the model and test the research hypotheses.

Results demonstrated that offline travel experiences positively influenced online community attachment (i.e., community dependence and identity), and this effect was more pronounced than that of one’s sense of community (i.e., belonging, trust and immersion) on community attachment. Therefore, compared with online interaction, offline travel experiences played a greater part in strengthening virtual community attachment.

The study presents a pioneering effort on understanding how offline activities help shape the community attachment to virtual communities.

本研究从线上-线下的角度探讨了人们对虚拟旅行社区的情感依恋形成机制, 着重关注线下旅游体验的作用。

本研究设计了问卷, 对经常举办线下旅游活动的驴友俱乐部进行了调查。采用结构方程建模方法估计模型并验证研究假设。

结果表明, 线下旅游体验积极地影响着线上社区依恋, 并且这种影响比社区感对社区依恋的影响更为显著。因此, 相较于线上互动, 线下旅游体验在增强虚拟社区依恋方面起到了更大的作用。

本研究首次探讨了线下活动如何帮助塑造虚拟社区成员对虚拟社区的依恋。

Websites have their own features in aspect preference (e.g. the relative importance platforms place on product aspects in product evaluation). The purpose of this paper is to capture characteristics of different book reviews on aspect preferences by opinion mining techniques.

The authors employ two indicators for identifying aspect preferences, and propose a method for quantifying overall differences of reviews on aspect preferences through three dimensions: aspect awareness, aspect satisfaction and comprehensive value.

The results show that book reviews on e-commerce websites contain information about external aspects of a book (e.g. hardcover), while those on social network websites pay more attention to content-related aspects of the book (e.g. stories). These results indicate that aspect preferences of reviews vary from platforms and make it hard to evaluate book comprehensively based on single-source data. Online book reviews from a wide range of sources can assess book impact from multiple perspectives and dimensions.

In order to illustrate the value of the authors’ method, the authors show book impact assessment based on multi-source data as an application of these difference analyses. Furthermore, the authors present an example of a book promotion to provide customized marketing services for different user clusters.

This study investigates the influence of different data sources on book evaluation from the content of book reviews. The authors also showcase potential applications of these analyses in book impact assessment.